Lu, Guo-Quan: search on Z-Library

The world's largest scientific articles store. 70,000,000+ articles for free.

1

Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow

Zhang, Z., Guo-Quan Lu

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2002

Language:

english

File:

PDF, 934 KB

english, 2002

2

Processing and Characterization of Nanosilver Pastes for Die-Attaching SiC Devices

Bai, John G., Calata, Jesus N., Lu, Guo-Quan

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2007

Language:

english

File:

PDF, 1.23 MB

english, 2007

3

Stacked solder bumping technology for improved solder joint reliability

Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A Dillard

Journal:

Microelectronics Reliability

Year:

2001

Language:

english

File:

PDF, 1013 KB

english, 2001

4

[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Application of Nano Silver sintering technique on the chip bonding for flip-chip and vertical light emitting diodes

Tao, Mian, Mei, Yun-Hui, Lee, S. W. Ricky, Yun, Feng, Lu, Guo-Quan

Year:

2016

Language:

english

File:

PDF, 988 KB

english, 2016

5

Effect of substrate flexibility on solder joint reliability

Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A Dillard

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 543 KB

english, 2002

6

Low-Pressure Joining of Large-Area Devices on Copper Using Nanosilver Paste

Zheng, Hanguang, Berry, David, Calata, Jesus N., Ngo, Khai D. T., Luo, Susan, Lu, Guo-Quan

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2013

Language:

english

File:

PDF, 11.62 MB

english, 2013

7

Chip-scale packaging of power devices and its application in integrated power electronics modules

Xingsheng Liu,, Xiukuan Jing,, Guo-Quan Lu

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 847 KB

english, 2001

8

Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area Chips

Lei, T.G., Calata, J.N., Guo-Quan Lu, Xu Chen, Shufang Luo

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2010

Language:

english

File:

PDF, 1.64 MB

english, 2010

9

Thermal management of power electronics modules packaged by a stacked-plate technique

Shatil Haque, William A. Stinnett, Douglas J. Nelson, Guo-Quan Lu

Journal:

Microelectronics Reliability

Year:

1999

Language:

english

File:

PDF, 477 KB

english, 1999

10

Technology trends toward a system-in-a-module in power electronics

Lee, F.C., van Wyk, J.D., Boroyevich, D., Guo-Quan Lu,, Zhenxian Liang,, Barbosa, P.

Journal:

IEEE Circuits and Systems Magazine

Year:

2002

Language:

english

File:

PDF, 657 KB

english, 2002

11

[IEEE 2017 IEEE Applied Power Electronics Conference and Exposition (APEC) - Tampa, FL, USA (2017.3.26-2017.3.30)] 2017 IEEE Applied Power Electronics Conference and Exposition (APEC) - A phase-leg IGBT module using DBC substrate without Ag finish by pressureless sintering of nanosilver paste

Yan, Haidong, Mei, Yunhui, Li, Xin, Chen, Gang, Lu, Guo-Quan

Year:

2017

Language:

english

File:

PDF, 3.81 MB

english, 2017

12

Effect of Silver Flakes in Silver Paste on the Joining Process and Properties of Sandwich Power Modules (IGBTs Chip/Silver Paste/Bare Cu)

Zhao, Su-Yan, Li, Xin, Mei, Yun-Hui, Lu, Guo-Quan

Journal:

Journal of Electronic Materials

Year:

2016

Language:

english

File:

PDF, 3.21 MB

english, 2016

13

Characterization of interfacial thermal resistance by acoustic micrography imaging

Shatil Haque, Guo-Quan Lu, J. Goings, J. Sigmund

Journal:

Microelectronics Reliability

Year:

2000

Language:

english

File:

PDF, 1.79 MB

english, 2000

14

Effects of device passivation materials on solderable metallization of IGBTs

Shatil Haque, Guo-Quan Lu

Journal:

Microelectronics Reliability

Year:

2001

Language:

english

File:

PDF, 251 KB

english, 2001

15

Thermo-Mechanical Reliability of Double-Sided IGBT Assembly Bonded by Sintered Nanosilver

Mei, Yun-Hui, Lian, Jiao-Yuan, Chen, Xu, Chen, Gang, Li, Xin, Lu, Guo-Quan

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 1.68 MB

english, 2014

16

Effects of solder joint shape and height on thermal fatigue lifetime

Xingsheng Liu,, Guo-Quan Lu,

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2003

Language:

english

File:

PDF, 2.30 MB

english, 2003

17

Feasibility investigation and characterization of low-pressure-assisted sintered-silver bonded large-area DBA plates

Tan, Yansong, Li, Xin, Chen, Xu, Yang, Zhenwen, Lu, Guo-Quan

Journal:

Soldering & Surface Mount Technology

Year:

2019

File:

PDF, 2.01 MB

2019

18

Simplification of the Nanosilver Sintering Process for Large-Area Semiconductor Chip Bonding: Reduction of Hot-Pressing Temperature Below 200/spl deg/C

Kewei Xiao,, Calata, Jesus N., Hanguang Zheng,, Ngo, Khai D. T., Guo-Quan Lu,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2013

Language:

english

File:

PDF, 8.50 MB

english, 2013

19

[IEEE 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Ipoh, Perak, Malaysia (2012.11.6-2012.11.8)] 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - “Low-temperature sintering of nanosilver paste for lead-free chip attach”

Year:

2012

Language:

english

File:

PDF, 232 KB

english, 2012

20

[IEEE 2017 IEEE Energy Conversion Congress and Exposition (ECCE) - Cincinnati, OH (2017.10.1-2017.10.5)] 2017 IEEE Energy Conversion Congress and Exposition (ECCE) - Bonding of large substrates by silver sintering and characterization of the interface thermal resistance

Gao, Shan, Yang, Zhenwen, Tan, Yansong, Li, Xin, Chen, Xu, Sun, Zhan, Lu, Guo-Quan

Year:

2017

Language:

english

File:

PDF, 450 KB

english, 2017

21

Fracture mechanics analysis of the effect of substrate flexibility on solder joint reliability

Xu Chen, Y.C. Lin, Xingsheng Liu, Guo-Quan Lu

Journal:

Engineering Fracture Mechanics

Year:

2005

Language:

english

File:

PDF, 629 KB

english, 2005

22

Design issues of a three-dimensional packaging scheme for power modules

Shatil Haque, Kalyan Siddabattula, Mike Craven, Sihua Wen, Xingsheng Liu, Dusan Boroyevich, Guo-Quan Lu

Journal:

Microelectronics Reliability

Year:

2001

Language:

english

File:

PDF, 641 KB

english, 2001

23

High-Temperature Operation of SiC Power Devices by Low-Temperature Sintered Silver Die-Attachment

Bai, John Guofeng, Yin, Jian, Zhang, Zhiye, Lu, Guo-Quan, van Wyk, Jacobus Daniel

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 1.15 MB

english, 2007

24

An innovative technique for packaging power electronic building blocks using metal posts interconnected parallel plate structures

Haque, S., Kun Xing,, Ray-Lee Lin,, Suchicital, C.T.A., Guo-Quan Lu,, Nelson, D.J., Borojevic, D., Lee, F.C.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 501 KB

english, 1999

25

Study on high temperature bonding reliability of sintered nano-silver joint on bare copper plate

Zhao, Su-Yan, Li, Xin, Mei, Yun-Hui, Lu, Guo-Quan

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 3.63 MB

english, 2015

26

Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material

Bai, J.G., Zhiye Zach Zhang, Calata, J.N., Guo-Quan Lu

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2006

Language:

english

File:

PDF, 1.13 MB

english, 2006

27

Flip-chip on flex integrated power electronics modules for high-density power integration

Bai, J.G., Guo-Quan Lu,, Xingsheng Liu,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2003

Language:

english

File:

PDF, 1003 KB

english, 2003

28

A novel multiscale silver paste for die bonding on bare copper by low-temperature pressure-free sintering in air

Li, Jie, Li, Xin, Wang, Lei, Mei, Yun-Hui, Lu, Guo-Quan

Journal:

Materials & Design

Year:

2018

Language:

english

File:

PDF, 1.82 MB

english, 2018

29

Magneto-optical current sensing for applications in integrated power electronics modules

John G. Bai, Guo-Quan Lu, Tao Lin

Journal:

Sensors and Actuators A: Physical

Year:

2003

Language:

english

File:

PDF, 483 KB

english, 2003

30

Pressure-Assisted Low-Temperature Sintering of Nanosilver Paste for 5$\,\times\,$5-${\rm mm}^{2}$ Chip Attachment

Gang Chen,, Yunjiao Cao,, Yunhui Mei,, Dan Han,, Guo-Quan Lu,, Xu Chen,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2012

Language:

english

File:

PDF, 1.96 MB

english, 2012

31

Parametric Study on Pressureless Sintering of Nanosilver Paste to Bond Large-Area (≥100 mm2) Power Chips at Low Temperatures for Electronic Packaging

Fu, Shancan, Mei, Yunhui, Li, Xin, Ning, Puqi, Lu, Guo-Quan

Journal:

Journal of Electronic Materials

Year:

2015

Language:

english

File:

PDF, 2.42 MB

english, 2015

32

Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling

Y.C. Lin, X. Chen, Xingsheng Liu, Guo-Quan Lu

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 658 KB

english, 2005

33

Reliability Improvement of a Double-Sided IGBT Module by Lowering Stress Gradient Using Molybdenum Buffers

Wang, Meiyu, Mei, Yunhui, Liu, Wen, Xie, Yijing, Fu, Shancan, Li, Xin, Lu, Guo-Quan

Journal:

IEEE Journal of Emerging and Selected Topics in Power Electronics

Year:

2019

Language:

english

File:

PDF, 7.20 MB

english, 2019

34

[IEEE ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Las Vegas, NV, USA (23-26 May 2000)] ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) - Finite-element modeling of thermal and thermomechanical behavior for three-dimensional packaging of power electronics modules

Wen, S., Guo-Quan Lu,

Year:

2000

Language:

english

File:

PDF, 497 KB

english, 2000

35

The Mechanism of Antifungal Action of a New Polyene Macrolide Antibiotic Antifungalmycin 702 from Streptomyces padanus JAU4234 on the Rice Sheath Blight Pathogen Rhizoctonia solani

Xiong, Zhi-Qiang, Tu, Xiao-Rong, Wei, Sai-Jin, Huang, Lin, Li, Xun-Hang, Lu, Hui, Tu, Guo-Quan, Virolle, Marie-Joelle

Journal:

Year:

2013

Language:

english

File:

PDF, 924 KB

english, 2013

36

Effects of thermal aging on long-term reliability and failure modes of nano-silver sintered lap-shear joint

Tan, Yansong, Li, Xin, Chen, Gang, Gao, Qitong, Lu, Guo-Quan, Chen, Xu

Journal:

International Journal of Adhesion and Adhesives

Year:

2019

Language:

english

File:

PDF, 4.78 MB

english, 2019

37

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Bonding 1200 V, 150 A IGBT chips (13.5 mm × 13.5 mm) with DBC substrate by pressureless sintering nanosilver paste for power electronic packaging

Fu, Shancan, Mei, Yunhui, Li, Xin, Lu, Guo-Quan

Year:

2014

Language:

english

File:

PDF, 953 KB

english, 2014

38

Effects of Voids in Sintered Silver Joint on Thermal and Optoelectronic Performances of High Power Laser Diode

Yan, Yi, Guan, Youliang, Chen, Xu, Lu, Guo-Quan

Journal:

Journal of Electronic Packaging

Year:

2013

Language:

english

File:

PDF, 1.76 MB

english, 2013

39

[IEEE 2016 IEEE Energy Conversion Congress and Exposition (ECCE) - Milwaukee, WI, USA (2016.9.18-2016.9.22)] 2016 IEEE Energy Conversion Congress and Exposition (ECCE) - Additive manufacturing of toroid inductor for power electronics applications

Yan, Yi, Moss, Jim, Ngo, Khai D. T., Mei, Yunhui, Lu, Guo-Quan

Year:

2016

Language:

english

File:

PDF, 961 KB

english, 2016

40

Glass for Encapsulating High Temperature Power Modules

Liu, Lanbing, Nam, David, Guo, Ben, Ewanchuk, Jeffrey, Burgos, Rolando, Lu, Guo-Quan

Journal:

IEEE Journal of Emerging and Selected Topics in Power Electronics

Year:

2020

File:

PDF, 2.17 MB

2020

41

Parametric Study of Joint Height for a Medium-Voltage Planar Package

Xiao Cao, Tao Wang, Ngo, K.D.T., Guo-Quan Lu

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2010

Language:

english

File:

PDF, 1.53 MB

english, 2010

42

Temperature Cycling Reliability Assessment of Die Attachment on Bare Copper by Pressureless Nanosilver Sintering

Zheng, Hanguang, Ngo, Khai D. T., Lu, Guo-Quan

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2015

Language:

english

File:

PDF, 1.03 MB

english, 2015

43

Investigation of Post-Etch Copper Residue on Direct Bonded Copper (DBC) Substrates

Yunhui Mei, Guo-Quan Lu, Xu Chen, Chen Gang, Shufang Luo, Dimeji Ibitayo

Journal:

Journal of Electronic Materials

Year:

2011

Language:

english

File:

PDF, 1.44 MB

english, 2011

44

Effect of Oxygen Partial Pressure on Silver Migration of Low-Temperature Sintered Nanosilver Die-Attach Material

Mei, Yunhui, Lu, Guo-Quan, Chen, Xu, Luo, Shufang, Ibitayo, Dimeji

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2011

Language:

english

File:

PDF, 385 KB

english, 2011

45

Rapid Sintering Nanosilver Joint by Pulse Current for Power Electronics Packaging

Mei, Yunhui, Cao, Yunjiao, Chen, Gang, Li, Xin, Lu, Guo-Quan, Chen, Xu

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2013

Language:

english

File:

PDF, 940 KB

english, 2013

46

Electromigration in Sintered Nanoscale Silver Films at Elevated Temperature

Calata, Jesus N., Lu, Guo-Quan, Ngo, Khai, Nguyen, Luu

Journal:

Journal of Electronic Materials

Year:

2014

Language:

english

File:

PDF, 647 KB

english, 2014

47

Effects of Large-Temperature Cycling Range on Direct Bond Aluminum Substrate

Guangyin Lei, T., Calata, J.N., Ngo, K.D.T., Guo-Quan Lu,

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2009

Language:

english

File:

PDF, 764 KB

english, 2009

48

Thermal characterization of planar high temperature power module packages with sintered nanosilver interconnection

Berry, David, Townsend, Adrian, He, Weikun, Zheng, Hanguang, Ngo, Khai D.T., Lu, Guo-Quan

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 1.83 MB

english, 2016

49

Reliability Evaluation of Multichip Phase-Leg IGBT Modules Using Pressureless Sintering of Nanosilver Paste by Power Cycling Tests

Fu, Shancan, Mei, Yunhui, Li, Xin, Ma, Changsheng, Lu, Guo-Quan

Journal:

IEEE Transactions on Power Electronics

Year:

2016

Language:

english

File:

PDF, 3.34 MB

english, 2016

50

Shrinkage and Sintering Behavior of a Low-Temperature Sinterable Nanosilver Die-Attach Paste

Tao Wang, Meihua Zhao, Xu Chen, Guo-Quan Lu, Khai Ngo, Shufang Luo

Journal:

Journal of Electronic Materials

Year:

2012

Language:

english

File:

PDF, 1.46 MB

english, 2012

To build up a library is to create a life. It’s never just a random collection of books.

— Carlos María Domínguez

Official channel

Z-Library Desktop Launcher

Z-Library Since 2009 support@1delivery.pm

EnglishРусскийEspañolItalianoελληνικάاللغة العربيةBahasa IndonesiaBahasa Malaysiaहिन्दीDeutschFrançaisPortuguêsУкраїнськаPolski中文繁體中文日本語Tiếng ViệtAzərbaycan DiliՀայոց լեզուภาษาไทยTürk Diliქართველიবাংলাپښتوతెలుగుاردو한국어SrpskiБългарски